Epoxy systems help create high density semiconductor electronics. They are economical, reliable, and efficient. In fact, they offer an inexhaustible list of end properties.
When it comes to protecting modern electronics from extreme conditions, coating and sealing with epoxy adhesives offers numerous benefits. Electronic circuits today can provide high performance through compact assemblies because modern engineering has created systems to be stable and reliable.
The Perfect Solution
The challenge until now has been how to secure components like ultrafine pitch technology, bare chip mounting, and flip chip assemblies to printed circuit boards in way that will protect against short circuits, heat dissipation, and protection of delicate parts during the process of manufacture.
This is where coating and sealing with epoxy adhesives proved to be a perfect solution. These adhesives are environmentally friendly and provides high bond strength. Epoxy compounds are ideal for structural bonding in printed circuit board assembly because they protect delicate electronic parts from vibrations, mechanical shock, and thermal cycling. They perform numerous functions.
What Are Epoxy Compounds?
So what exactly are epoxy compounds? They are solvent-free polymer properties that stick well to many different materials to create tough, durable bonding. They are created by combining epoxy resins (one or more), a curing agent, and fillers (organic or inorganic).
Epoxy products have a versatile quality. They can be formulated in a number of ways to create different types of performance. Formulations can be manufactured to resist cryogenic conditions, to withstand ultra-high temperatures, to bond specific types of materials, and to meet taxing industry standards. Examples of stringent standards include UL 94V-0 flammability specs, NASA low outgassing specs, or tests for USP Class VI biocompatibility.
These formulations can be controlled to provide resistance to chemicals, moisture, temperature, shocks, and vibrations. They also provide thermal and electrical conductivity. Additionally, viscosity, flexibility, durability, and hardness can be controlled, as well as cohesive strength.
These very specific formulations are required by electronic companies, by defense manufacturers, and by the aerospace industry. What’s more, these formulations can be delivered in a number of different ways to meet manufacturing requirements like solids, films, pastes, or liquids.
Epoxy compounds (1 or 2 compounds) can be cured according to different schedules. This range includes snap cures, fast cures through elevated temperatures, and prolonged cures through ambient temperatures.
Summary of Uses
An epoxy system, then, can be used in a variety of ways to bond substrates together or protect them from environmental contamination. It can be used as an adhesive, sealant, or coating. It can also be used when potting or encapsulation is desired.